Unimicron Raised Its AI Substrate Budget a Third Time This Year. The New Factories Are Rising in Thailand, Not Taiwan.
By Michele De Filippo
Close-up of a robotic arm lowering a gold-fingered printed circuit board substrate panel onto a conveyor inside a brightly lit factory, with stacks of thin green substrate panels waiting beside the line
08 Aug 2026

The so-what

Unimicron just raised its 2026 capital budget for the third time this year, and the company's own margins are the clearest sign of how expensive that bet has become. Second-quarter gross margin fell to 13.2 percent, a recent low, even as earnings per share hit a record NT$8.45 1. That is the picture across Taiwan's IC-substrate industry right now: spend first, ask for pricing power later. What has changed in the past eight weeks is where the money is actually going. Increasingly, it is not going to Taiwan.

The third capex raise in seven months

Unimicron's board lifted 2026 capital expenditure from an already-revised NT$34 billion to NT$53.7 billion, an increase of NT$19.7 billion in a single decision 1. Roughly 80 to 85 percent of the new money is earmarked for ABF substrates, the packaging material that sits between an AI accelerator die and the circuit board and has become the tightest chokepoint in the AI hardware chain. Management said it is placing equipment orders early specifically to lock in capacity for 2027 and 2028, a tell that lead times on substrate-plating and lamination tools are stretching well past a year. Zhen Ding Technology moved first: in March it raised its combined 2026 to 2027 capex plan from NT$60 billion to NT$100 billion, describing the jump as necessary to seize what its chairman called a golden decade for AI servers, optical interconnects and IC substrates 5. Both companies are now executing, not just guiding, and the two decisions together add up to more than NT$100 billion in incremental substrate and PCB spending inside a single year.

Why the new money skips Taiwan

The distinctive part of this cycle is geography. Zhen Ding's July capacity announcement centered on expanding its Thailand operations, paired with new industry-academia partnerships to train local PCB and chip talent, a sign the company sees Thailand as a permanent production base rather than overflow capacity 4. Unimicron's Thailand plant, focused on server-grade HDI boards, is on the same trajectory. Neither company is retreating from Taiwan; both are still raising domestic capex too. But the marginal factory, the one being built to meet the AI demand nobody forecast eighteen months ago, is increasingly a Southeast Asian one. Nation Thailand's reporting found that close to 60 Taiwanese and Chinese PCB manufacturers have opened new Thai factories in under three years, a pace that only accelerated once Washington's tariff regime made a Taiwan-plus-one hedge look less optional and more like table stakes 7. What began as a China-tariff workaround for lower-end boards has become the default location for new high-end substrate lines as well.

Malaysia's substrate bet

Austria's AT&S is running the same playbook a few hundred kilometers south. The company committed up to 2 billion euros to expand its Kulim, Malaysia campus, building new IC-substrate core and advanced HDI lines anchored by a long-term supply agreement with AMD and a second, unnamed technology customer 2 3. AT&S simultaneously raised its 2026-27 revenue growth guidance to 45 to 55 percent, up from 30 to 35 percent previously, and set total group capex for the year at roughly 1.0 to 1.2 billion euros 3. That an Austrian firm anchored by an American chip customer chose Malaysia, not Taiwan or its home base in Europe, for its single largest substrate investment underscores that this is not a Taiwan story with a Southeast Asian footnote. It is a Southeast Asian capacity build-out that Taiwanese and European suppliers are both racing to join. Industry coverage of the broader shift now describes Google and Microsoft's cloud infrastructure spending as a direct pull factor drawing substrate and laminate makers toward Thailand and Malaysia specifically, rather than simply toward lower-cost Asian manufacturing in general 6.

The supply gap behind the rush

The spending is a response to a scarcity problem, not a growth story chased for its own sake. ABF substrate capacity has lagged AI accelerator demand for three straight years, and every major supplier from Taiwan's Nan Ya and Kinsus to Japan's Ibiden has been sold out on advanced product for quarters at a time. That is why Unimicron can post a record EPS and a collapsing margin in the same earnings call: the company is running its existing lines flat out while paying up for equipment it will not receive until 2027. It is also why the geographic shift matters more than the raw capex figures. Substrate lead times are long and site-selection decisions, once made, are effectively irreversible for five to seven years. Thailand and Malaysia are not simply picking up overflow demand; they are becoming co-equal nodes in a supply chain that used to be almost entirely concentrated in Taiwan, South Korea and Japan.

What it means for investors

For investors, the near-term signal is margin pressure, not margin expansion: substrate makers are prepaying for 2027 to 2028 capacity while 2026 utilization and pricing lag behind, which is exactly what Unimicron's compressed gross margin shows. The medium-term signal is different. Once the new Thai and Malaysian lines ramp in 2027, the companies that locked in equipment and land early, Unimicron, Zhen Ding and AT&S among them, should hold a structural cost and capacity advantage over rivals still confined to Taiwan's tighter industrial land and labor market. The risk sits with governments and site operators: Thailand's grid and skilled-labor base are already stretched by roughly 60 new PCB entrants, and any permitting or power delay pushes 2027 substrate supply right back into deficit. Investors pricing AI hardware exposure through GPU and foundry names alone are missing where a real bottleneck is quietly relocating.

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